Responsibilities:
\xc2\xb7 To setup descum and sputtering (Ti/Cu) Process.
\xc2\xb7 To develop and to industrialize descum and sputtering (Ti/Cu) process, introduce materials to meet the quality, yield, and mission of new application.
\xc2\xb7 To support assembly of engineering sample for new packages or new technologies.
\xc2\xb7 To characterize descum and sputtering process and materials.
\xc2\xb7 To generate and update process specifications, SOP, FMEA and process control plan.
\xc2\xb7 To provide technical support when there are critical quality concerns related to descum/sputtering material/process.
Profile
Requirements:
\xc2\xb7 More than 3 years working experience.
\xc2\xb7 Masters/Bachelor\xe2\x80\x99s Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.
\xc2\xb7 Equipped with statistical data analysis, analytical and problem-solving skills especially at Descum and Sputtering process.
\xc2\xb7 Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is not\xe2\x80\xa6etc.
\xc2\xb7 Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.
\xc2\xb7 Practice high performance behavior and together work as Team in executing projects & strive for excellent.
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