Job Description

MalaysiaJob details Posted 05 December 2024 SalaryRM7000 - RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond & Die Bonding.Key Responsibilities:

• Lead and manage the wire bonding and die bonding processes, ensuring high-quality output and process efficiency.
• Develop and optimize manufacturing processes for wire bonding and die bonding applications to meet production and quality targets.
• Provide technical expertise and troubleshooting support for wire bonding and die bonding issues.
• Work closely with cross-functional teams to implement process improvements, reduce costs, and enhance product performance.
• Drive continuous improvement initiatives, including yield enhancement and cycle time reduction.
• Prepare and maintain documentation related to processes, materials, and equipment qualifications.
• Collaborate with suppliers and equipment vendors to ensure proper maintenance, upgrades, and troubleshooting of bonding equipment.
• Mentor and train junior engineers and technicians, fostering a culture of technical excellence.

Skills & Experience Required:

• Bachelor's or Master's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• Minimum of 7 years of experience in wire bond and die bonding processes within a semiconductor manufacturing environment.
• Extensive hands-on experience with epoxy die attach processes, particularly with 8-inch to 12-inch wafers.
• Strong understanding of semiconductor materials, processes, and equipment.
• Proven track record in troubleshooting and resolving complex process challenges.
• Familiarity with advanced packaging technologies and trends.
• Excellent problem-solving, analytical, and communication skills.
• Ability to lead projects and work effectively in a collaborative team environment.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobSr Process Engineer (Wire Bond, Die Bond)Malaysia Posted about 7 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.Agensi Pekerjaan Ambition Group Malaysia Sdn. Bhd.JTK Number: JTKSM 995Company Registration Number: 201301019088 (1048918-T)MalaysiaSuite 8.03 & 8.05, Level 8, The Gardens North Tower, Mid Valley City, Lingkaran Syed Putra

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