Job Description

MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is a rapidly expanding Multinational Semiconductor company in Penang.Key Responsibilities:

• Supervise hybrid power module processes to ensure high efficiency, yield, and quality.
• Enforce 10K cleanroom standards rigorously.
• Manage and enhance assembly processes, covering wire bonding, solder-paste printing, component placement, reflow technologies, and coating.
• Apply Lean Six Sigma principles to pinpoint areas for enhancement and execute data-driven solutions.
• Maintain process stability and product quality using Statistical Process Control tools.
• Fine-tune process parameters and reduce variability through Design of Experiments techniques.
• Analyze semiconductor failures at their root.
• Implement preventive maintenance methods to boost equipment uptime.
• Conduct process audits and apply improvement measures.
• Develop and update process documentation, including FMEA and SOPs.
• Mentor and train team members.
• Collaborate with cross-functional teams for seamless integration and communication.
• Troubleshoot process issues and apply corrective measures.
• Keep abreast of industry best practices and emerging technologies.
• Contribute to the advancement of new processes and technologies.
• Ensure activities align with organizational standards and policies.
• Fulfill other assigned duties.

Skills & Experience Required:

• Proven track record in optimizing manufacturing processes using Lean Six Sigma.
• Proficiency in 10K cleanroom operations and backend power semiconductor processes.
• Strong skills in SPC tools, Cpk analysis, and DoE techniques.
• In-depth understanding of semiconductor failure analysis.
• Experience in preventive maintenance and processing documentation.
• Effective communication and organizational abilities.
• Proactive mindset with project management skills.
• Experience:

• Essential: Minimum 15 years in process engineering/management in power semiconductor manufacturing, including 5+ years in leadership roles.
• Desirable: Black-belt Lean/Six Sigma Certification.
• Education:

• Essential: Bachelor\'s degree in Mechanical Engineering or Material Science.
• Desirable: Master\'s degree preferred, along with Lean/Six Sigma Certification.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn\'t quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobSr Process Engineering Manager (Wire Bond)Malaysia Posted about 11 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.

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