Job Description

In your new role you will: Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc.) activities for package projects with major changes/new package, risks and impact. Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed. Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements. Coordinate the package Cost Estimation (A1-A3) and Cost Indication(A3). Be the contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how. Support pre development & project definition stage, and continue to be package design expert throughout project phase. Consolidate the inputs for ADR and ensure the contents are updated (A project). Drive innovation and pre development activities within the package platform. Your Profile You are best equipped for this task if you have: Bachelor\'s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, Physics, Chemistry). Relevant experience in Semiconductor Packaging, Assembly and Test. Process and Equipment Engineering knowledge. Good understanding on various Failure Analysis techniques and Reliability Engineering. Good Analytical and Problem Solving Skills. Experienced in AutoCAD 2D and 3D drafting preferred. Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.

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