In your new role you will: Yield improvement activities for Die Attach process Sustain and achieve stability index for package under responsibility Support production on daily issues investigation and improvement in order to achieve Operation performance Sustain and achieve quality stability for DPAK module DA process to achieve zero spill, FAR Documents update and refine to ensure no expired documents. Your Profile You are best equipped for this task if you have: Bachelor degree in engineering Knowledge in die attach process and skill ESEC 2007/2009 Soft Solder and Diffusion Soldering Knowledge in process engineering Basic statistical and SPC knowledge Basic problem solving skill 8D, MRB, DMAIC Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.
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