Supports testing of semiconductor packages related to product defects.
Perform system and component-level analysis using simulation tools, including signal integrity, power integrity, and integrated circuit electromagnetic compatibility (EMC) analysis and packaging ).
Understand line problems and work with customers to improve product quality.
Responsible for testing evaluation, characterization, qualification, and keeping abreast of new technologies and industry trends in electrical and electronics engineering for IC packages.
Create technical documentation such as schematics, layouts and manuals related to IC packaging and testing, participate in design reviews, risk assessments and safety reviews related to packaging and testing Testing integrated circuits in a mass production environment.
Generate results based on data and statistical results for analysis that leads to solving the problem and its possible root causes.
Job Requirements:
Possess Bachelor Degree in Engineering or equivalent
At least 2 years of experience in the Semiconductor/ Electronics industry.
Good communication skill and have the ability to communicate effectively with other function teams
Experienced & Knowledgeable in 8D methodology, APQP, PPAP, FMEA, SPC.(MiniTab or similar tools), MSA tool, Six Sigma, etc.
Able to work in a team and individually and in a fast environment
Applicants must be willing to work in Senai, Johor.