Job Description

Responsibilities: \xe2\x80\xa2 Responsible for product transfer for testing. \xe2\x80\xa2 Actively involve in maintaining and improving test yield / quality programs. \xe2\x80\xa2 To evaluate and implement new method or procedure to improve production. \xe2\x80\xa2 To trouble-shoot on engineering related issue. To lead and drive improvement activities. \xe2\x80\xa2 To interface with customer, production & maintenance on product / process optimization & improvement. \xe2\x80\xa2 To work on material and cost savings projects. Requirements: \xe2\x80\xa2 Degree in Electrical, Electronics, Mechatronics, Computer, Telecommunications Engineering or any other related discipline. \xe2\x80\xa2 Related working experience in Back-End Testing in Semiconductor industry will be an advantage. \xe2\x80\xa2 Ability to multi-task simultaneous projects. \xe2\x80\xa2 Equip with strong supervisory skill, analytical skill, planning skill and communication skill.
Unisem is a global provider of semiconductor assembly and test services for many of the world\xe2\x80\x99s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. Unisem designs and creates both Laminate and Leadframe packages for the global IC market. Our turn-key services include Electrical and Thermal Characterization, Design, Assembly, Testing, Failure Analysis and more. And with our real-time WIP systems and drop shipping to OEM\xe2\x80\x99s, Unisem offers its customers everything needed for time-to-market wins. Unisem offers a broad range of standard and custom Leadframe and Laminate packages with pin counts ranging from 3 to 484+. Also offered are WLCSPs or Wafer-Level Chip-Scale Packages which is a low cost solution that enables direct connectivity at the substrate or board level. With approximately 7,000 employees worldwide, Unisem has factory locations in Ipoh, Malaysia and Chengdu, People\xe2\x80\x99s Republic of China. The company is headquartered in Kuala Lumpur, Malaysia.
Bachelor\'s or Equivalent