Job Description

MalaysiaJob details Posted 17 September 2024 SalaryRM10000 - RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur client is a multinational semiconductor company in Malacca. Due to rapid expansion, they are seeking a Principal Wire Bond Process Engineer.Key Responsibilities:

• Process Development and Optimization:

• Develop and optimize wire bonding processes for new and existing semiconductor packages.
• Perform process characterization, validation, and optimization to enhance yield, reliability, and cost-effectiveness.
• Utilize Design of Experiments (DOE) and statistical analysis to refine wire bonding parameters.
• Collaboration and Cross-Functional Support:

• Work collaboratively with design, manufacturing, quality, and supply chain teams to ensure seamless integration of wire bonding processes.
• Support new product introduction (NPI) by developing wire bonding solutions tailored to specific product requirements.
• Interface with equipment vendors and materials suppliers to evaluate new technologies and materials for wire bonding.
• Problem Solving and Continuous Improvement:

• Investigate and resolve process-related issues using root cause analysis and implement corrective actions.
• Drive continuous improvement initiatives to enhance process capabilities, yield, and reliability.
• Develop and maintain process documentation, including specifications, procedures, and work instructions.
• Training and Development:

• Provide technical training and support to manufacturing teams on wire bonding processes and equipment.
• Stay current with industry trends and advancements in wire bonding technologies and materials.

Skills & Experience Required:

• Education:

• Bachelor\'s or Master\'s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• Experience:

• 3+ years of experience in semiconductor packaging, specifically in wire bonding process development.
• Proficiency in using wire bonding equipment and tools.
• Experience with statistical process control (SPC) and DOE methodologies.
• Skills and Competencies:

• Strong analytical and problem-solving skills.
• Excellent communication and teamwork abilities.
• Knowledge of semiconductor packaging materials and processes.
• Ability to manage multiple projects and priorities in a fast-paced environment.
• Proficiency in using statistical software and data analysis tools.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn\'t quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobWire Bond Principal Process EngineerMalaysia Posted about 21 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.Agensi Pekerjaan Ambition Group Malaysia Sdn. Bhd.JTK Number: JTKSM 995Company Registration Number: 201301019088 (1048918-T)MalaysiaSuite 8.03 & 8.05, Level 8, The Gardens North Tower, Mid Valley City, Lingkaran Syed Putra

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