Job Description

MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor company is seeking a Wire Bond Process Engineer to join it\'s dynamic organization.Key Responsibilities:

• Perform process optimization to achieve the better wire bond yield and product quality as well as process robustness to meet the process Cpk.
• Hands on for recipe management system in consolidating the wire bond recipes by different die type, package type and design ID.
• Involved actively in solving wire bond related issues (e.g. broken wires, lifted pad, slack wires, lifted stitch, IMC crack, bond pad crack) through 8D methodology.
• Responsible to characterize the package / process systematically to exceeding quality and reliability requirements.
• Responsible in understanding the key parameters definition and implement necessary control plan to achieve the 1st time right of process manufacturability.
• Proactively conduct process optimization and improvement during feasibility to low volume (safe launch) phase to ensure successful High-Volume Manufacturing.
• As process owner and responsible to derive corrective action whenever encounter any quality or technical issue in respect to the project.

Skills & Experience Required:

• Masters/Bachelor\'s Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.
• Familiar with development of Power packages (PQFN, SO8FL, SOIC, TOLL etc.) an added advantage.
• Min 3 years working experience as Wire Bond process development / process engineer in Semiconductor Manufacturing environment.
• Good in critical thinking and systematic problem-solving skills e.g. DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bond, IS-IS NOT etc.
• Good written and verbal presentation skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn\'t quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobWire Bond Process EngineerMalaysia Posted about 15 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.Agensi Pekerjaan Ambition Group Malaysia Sdn. Bhd.JTK Number: JTKSM 995Company Registration Number: 201301019088 (1048918-T)MalaysiaSuite 8.03 & 8.05, Level 8, The Gardens North Tower, Mid Valley City, Lingkaran Syed Putra

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