Die Bond Process Engineer
Malaysia, Malaysia
Job Description
Job details
Posted 04 November 2023
SalaryRM5000 - RM8000 per annum
LocationMalaysia
Job type Permanent
DisciplineEngineering
Reference268089_1699091116
This leading semiconductor company in Melaka is seeking a Die Bond Process Engineer due to rapid expansion.
Key Responsibilities:
- Responsible for Die Bond process engineering segment from manufacturing.
- Handle yield improvement, quality improvement, disposition on-hold material and etc.
- Active team participation on new package / platform / technology development from design to production release.
- Perform package integrity analysis using appropriate tools.
- Engage in new material assessment and development.
- Collaborate with equipment supplier on design, tooling upgrade, process development and software improvement for new process introduction.
- Maintain product quality while developing and introducing package cost reduction programs.
- Timely develop and introduce new products with competitive cost/ differentiation
- To optimize and perform proof of principles independently on existing/newly developed platform/product
- Characterize, evaluate and define Packaging Design Rule and New Package Specification.
- Coaching to junior engineer and technician on process and equipment.
- Bachelor / Master Degree in Engineering (Electronics, Electrical, Mechanical) or Physics.
- Minimum 5 years relevant experience in related field.
- Experience in semiconductor package design, advance packaging experience, and Assembly process control is preferred.
- Knowledge in die bond, solder print, reflow, Xray / CSAM inspection, power module assembly is preferred.
Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.
JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)
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Job Detail
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Job IdJD990827
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationMalaysia, Malaysia
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EducationNot mentioned