Job Description

In your new role you will: Responsible for making timely and accurate decisions regarding overall team /engineering results for Platform and Segment Prioritize PT activities with the right resources and make effective decisions in support of a compact project plan, using right techniques includes 8D approach , DMAIC for problem solving Lead and manage PT team to support project teams to realize A/I Projects, Pre - DEV projects, InnoNET deliverables and strategic or roadmap initiatives. Be part of the management team and responsible to achieve defined target i.e. T2M, Quality, performance target and support the platform in realizing the Platform KPI To drive Technology integration to ensure inter process related risk are mitigated and addressed To define packaging solution for BLs to fit into product requirements, include package construction, layout. To drive Innovative solution in material development including leadframe and substrate designs to realize innovative and new packaging concept. Execute and promote technical leadership towards greater technical competency in the relevant FOK. Representing development , interfaces to Business Division and Multi development locations and internal partners on problem solving, new process development and best practice sharing & implementation. Your ProfileYou are best equipped for this task if you have: Masters/Bachelor\'s Degree in Engineering (Electrical / Electronics /Microelectronics / Mechanical / Materials etc). 12 years of experience in semiconductor related industry. Experience in leading a team of professional engineers and team managers (minimum 5 peoples) Analytical and problem solving skills (8D, DMAIC). Knowledge inIntellectual Property process. Experience inSemiconductor Process Engineering. People Management & leadershipskills. Knowledge in semiconductor packaging will be an added advantage Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.

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