Job Description

Location: Melaka
Job ID: HRC0227105

Job description
In your new role you will:

• Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc) activities for package projects with major changes/new package, risks and impact.
• Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed.
• Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
• Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
• Act as the Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
• Support pre-development & project definition stage, and continue to be package design expert throughout project phase.
• Actively scout for new packaging technologies and keep in touch with package development at competitors/ subcons.
• Consolidate the inputs for ADR and ensure the contents are updated (Aproject).
• Main contact person and technical consultant/coach for all questions and discussion regarding packaging, package design and Package.
• Drive innovation and pre-development activities within the package platform.

Your profile
You are best equipped for this task if you have:

• Bachelor Degree of Engineering in Semiconductor Technology/ Microelectronics/ Automation/ Mechanical/ Electrical/ Electronics Physics.
• Background in Semiconductor Packaging, Assembly and Test.
• Process and Equipment Engineering knowledge.
• Failure Analysis and Reliability Engineering knowledge.
• Analytical and Problem Solving Skills.
• AutoCAD and 3D drafting preferred.

Driving decarbonization and digitalization. Together.

Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.

Infineon Technologies (Malaysia) Sdn Bhd, with its 8.000 employees, is the largest manufacturing site of Infineon. The company has established itself as a leading manufacturing site for Power Semiconductors, Logic Semiconductors, Discrete and Sensor Products. We are committed to increasing productivity, on-time delivery and providing customized solutions while maintaining the highest level of product quality. The success of Infineon Melaka is evidenced by eleven National Awards received from the Prime Minister\'s Office as well as 15 corporate awards

Does this sound like just the right challenge for you? If so, we look forward to getting to know you!

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Infineon