3 years working experience in electronics or semiconductor manufacturing industry
Experience in FOL process (Die Bond or Wire Bond)
Good understanding of TPM and Maintenance systematics
Good understanding of machine mechanism and capable to perform PM activities
Good communications and interpersonal skills.
Driving decarbonization and digitalization. Together.Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant\xc2\xb4s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.Does this sound like just the right challenge for you? If so, we look forward to getting to know you!(It only takes 90 seconds)