Equipment Associate Engineer (die Attach/wire Bond)

Bayan Lepas, M07, MY, Malaysia

Job Description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.
Experience in DA or WB Maintaining and sustaining job on variety equipment to control downtime. Perform machine conversion, tool change & PM to support production. Normal working over and support overtimes (ot) at all times as required. Ability to take instruction and adapt to changes instructed or given by superior. Maintain 5S for machine and working environment. Maintain machine and working environment ready for audit Support improvement projects assigned by engineer

Having at least SKM level 3 certificate or Diploma qualification Min 5 years of experience in equipment maintenance especially in Die Attach or Wire Bond areas. Min 5 years of experience in Back End manufacturing environment. Mechanical, sensors and eletrical/electronics knowledge is preferred. Good communication in English & Bahasa Malaysia. * Good Teamwork and Cross functional cooperation.

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Job Detail

  • Job Id
    JD1266658
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Bayan Lepas, M07, MY, Malaysia
  • Education
    Not mentioned