Job Description

Primary Responsibilities:

Failure Analysis:

1. To perform FA on devices which are reported to be failing electrical test from Manufacturing/NPI or customer return.

2. To write quality FA report and provide conclusive findings that can help engineering team to root cause the issue.

3. To innovate FA approach or methodology to improve FA capability and cycle time at the lowest cost for the benefits of the organization.

4. Improve FA workstations & foster team safety awareness.

Reliability:

5. Execute Product Reliability Stress in Reliability Lab. Manage stress test chamber activities loading plan and chamber capacity.

6. To perform package delamination analysis by using SAM (Scanning Acoustic Microscopy) machine.

7. To perform machine operation for HAST, Bake Oven, Reflow, Temp Cycle chamber, Burn In Oven and other Reliability machines as needed.

8. Innovate and improve overall reliability lab machine capacity. Ensure proper PM, Cal and 5S within Reliability Lab.

Qualification & Experience:

Minimum qualification is a Diploma in Electronics/Microelectronics. The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company. Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.
Job Types: Full-time, Permanent, Fresh graduate

Pay: RM2,100.00 - RM3,800.00 per month

Benefits:

Opportunities for promotion Professional development
Work Location: In person