Job Description

The IC Package Materials Engineer works in the PI Global Materials group with a global leadership focus to drive packaging materials for various NXP business units, through in-depth material characterization / testing of fundamental thermo-mechanical, moisture, kinetic, structural, electrical and interfacial behavior under reliability conditions for package product applications. The engineer works with the Mechanical, Thermal and Electrical Modeling engineering team to develop materials-based constitutive relations to provide enhanced predictive behavior of electronic package. The engineer provides direction on new Semiconductor IC Package Material acquisition working with material suppliers and BE Final Mfg., Process, Quality, and Commodity Engineering Team to ensure applicable total cost and fit for NXP product-package technologies. Specifically, the engineer leads packaging material investigations, sourcing, co-development, characterization and reliability for different IC die - package materials; adhesives and die attach adhesives (conductive adhesives, Pb-free solder, Ag sintering pastes, die attach films, etc.), solder alloys, gels, underfills, thermoset epoxy mold compounds, substrate technologies (cores, soldermasks), leadframes, etc.

The IC Package Materials Engineer interactions involves collaboration with other Engineers in Packaging, Process Assembly, Modeling and Simulations, Silicon Fab Process and EHS to define manufacturable and reliable packaged products. This role includes working with the Quality organization to resolve immediate customer quality issues and the external customers supporting package performance. The engineer drives advanced package material selection through standard and innovative solutions to meet NXP's total product package performance requirements across the product applications. The engineer will be stationed in NXP Kuala Lumpur Malaysia Factories working closely with the different organizations to execute on NXP's product-package technologies.