Lead Engineer, Firmware/ses
Job Description
General Overview Functional Area: Engineering Career Stream: Design Engineering Software Controls SAP Short Name: LEN-ENG-DSW Job Level: Level 08 IC/MGR: Individual Contributor Direct/Indirect Indicator: Indirect Key leadership skills Must be Self driven in learning the existing and new technical skills. Be collaborative with cross-functional teams and with customersto deliver the best Ability to understand the Architecture, design from the product and solution perspective Ability to contribute and engage in authorized open source and external tech forums Required Domain skills Strong SW development and debugging skills - RTOS, Linux Strong firmware programming skills, C, Python Experience in SAS, SATA and NVMe technologies Hands-on experience with one or more of Broadcom, Microchip SDK Desirable: Experience in I2C, LED, PSU and related Driver and Firmware development Education and Experience 6 to 9 years of experience with Bachelors or Master degree in Electronics, Computer Science, or Electrical Engineering
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Job Detail
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Job IdJD965048
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationPulau Pinang, Malaysia
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EducationNot mentioned