Job Description

Physical failure analysis (PFA) involves the localisation, imaging, and characterisation of manufacturing defects in our products. Analysts will be expected to:Utilise a wide variety of fault localisation and imaging tools/techniques, including but not limited to Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Energy Dispersive X-ray Spectroscopy (EDX), Focused Ion Beam (FIB), SEM-based NanoproberUnderstand electrical failure analysis (EFA) data and determine the best PFA plan forward based on that dataDocument findings in professional reports to be shared with various stakeholdersCollaborate with cross-departmental teams such as Customer Quality Engineering, Manufacturing, and other FA labsHave an understanding of manufacturing processes and the root cause of defectsJob QualificationBachelor\'s or Master\'s degree \xe2\x80\x8bin Electrical/Electronics/Materials EngineeringFresh Graduates or with not more than 2 years\xe2\x80\x99 work experienceBasic technical knowledge of semiconductor physics and MOSFET operationsKnowledge of common computer software packages, such as Word, Excel, PowerPoint, etcAble to work with chemicals, X-Ray, Electron and Ion Beam toolsComfortable with handling small and delicate samples with tweezersThe following are not required but would be a benefit/plus:Experience in a laboratory/wafer fab/similar manufacturing environmentExperience with beam tools (SEM/TEM/FIB)Familiar with the FA process flow and analysis techniquesKnowledge of semiconductor manufacturing processes (wafer fabrication as well as assembly)Strong problem solving skills, (e.g., 8D or similar practice) attention to detail, good communication skills (both written and verbal) and the ability to produce quality results in a timely fashion are also essential attributes.

NXP Semiconductors