Min 8 years related experience in FOL (especially Ball Bonding)Process Engineering or in Semiconductor Assembly Manufacturing background.
Statistical data analysis, analytical and problem solving skills.
Ability to anticipate issues and challenges and resolving them quickly.
Expert in prosses knowledge and skills in manufacturing process &some equipment knowledge.
Systematic Problem Solving methodology (e.g. 8D, DMAIC, Process Mapping, FTA & Fish Bond)
#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicants experience and skills. Learn more about our various contact channels. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.