Process Development Engineer (wet Treatment)
Johor, Malaysia
Job Description
Seeking for Front-of-line experts in Wafer Fabrication within specialising in equipment and/or process development
- To setup Assembly Laser Structuring/Laser Cut Process.
- To setup plating (Cu/Tin) process.
- To develop and to industrialize Cu plating process with vertical and horizontal equipment for new packages, introduce materials to meet the quality, yield, and mission of new application.
- To support assembly of engineering sample for new packages or new technologies.
- To characterize assemble plating process and materials
- To generate and update process specifications, SOP, FMEA and process control plan.
- To provide technical support when there are critical quality concerns related to assembly EOL material / process.
- More than 3 years working experience.
- Masters/Bachelor\'s Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.
- Equipped with statistical data analysis, analytical and problem-solving skills especially at plating process.
- Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is not\xe2\x80\xa6etc.
- Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.
- Practice high performance behavior and together work as Team in executing projects & strive for excellent.
- New Role to Pioneer in!
- Attractive salary & benefit
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Job Detail
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Job IdJD898785
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:84000 - 120000 per year
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Employment StatusPermanent
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Job LocationJohor, Malaysia
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EducationNot mentioned