Job Description

Our client is a leading and fast-growing semiconductor company seeking a seasoned R&D leader to drive innovation, cost optimization, and readiness for high-volume manufacturing. This role oversees product and packaging development while aligning technical direction with business goals.
Key Responsibilities:

• Lead R&D strategy with a focus on innovation, cost reduction, and manufacturability

• Oversee product and packaging design to ensure fast, cost-effective time-to-market

• Collaborate with customers and internal teams on new materials, processes, and technology readiness

• Align technical development with business objectives and advise management on key trends

• Stay ahead of industry and technology developments to guide strategic direction

• Manage pilot line operations and drive continuous improvement initiatives

Skills & Experience Required:

• Degree in Engineering or a related field

• Proven experience in semiconductor R&D, product/packaging design, or process development

• Strong leadership, cross-functional collaboration, and communication skills

• Demonstrated ability to manage innovation, cost strategies, and pilot-scale operations

• Knowledge of industry trends, emerging technologies, and manufacturing scalability

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.
Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.
JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)
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