Job Description

Job Responsibilities:

Develop, implement, and maintain quality systems and procedures to support bumping, wafer testing, and IC assembly processes. Perform root cause analysis and implement corrective and preventive actions (CAPA) for customer and internal issues. Lead quality improvement initiatives and ensure compliance with industry standards such as ISO 9001, IATF 16949, and JEDEC. Collaborate with engineering teams to define quality requirements for new products and process changes. Conduct internal audits and support customer and third-party audits. Analyze quality data (yield, reliability, defects, etc.) and provide reports and recommendations. Handle customer complaints and ensure timely and effective resolution. Participate in new product introductions (NPI) to ensure quality standards are met from the design stage. Manage documentation related to quality control, inspection, and test results. Support supplier quality management and incoming material inspections.

Requirement

:

Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field. 2-5 years of relevant experience in semiconductor packaging, testing, or manufacturing quality assurance. Prior experience in the high-tech or semiconductor industry is preferred. Familiarity with IC packaging technologies such as wafer bumping, wire bonding, flip chip, and WLCSP is a strong plus. Experience with quality management systems (QMS) and standards (e.g., ISO 9001, IATF 16949).
Job Type: Full-time

Pay: RM3,000.00 - RM4,000.00 per month

Education:

Diploma/Advanced Diploma (Preferred)
Experience:

ISO9001: 2 years (Preferred) Quality assurance: 2 years (Preferred)
Language:

Mandarin (Required)
Work Location: In person