Job Description

In your new role you will: Drive leadframe material development activities to ensure the package fulfill all requirement in the aspect of manufacturing, product qualification and reliability. Be the technical expert for lead frame material in package development projects. Perform design, drawing and specification for leadframe based on design guideline, assembly rules and ensure design for manufacturing, quality and cost. Collaborate with internal and material supplier on packing material design, specification and selection and ensure design for manufacturing, quality and cost. Drive leadframe/packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc). Liaise with SQM and supplier to ensure fulfilment of quality requirement / FAI for leadframe and qualification release. Establish design guideline/requirement for leadframe material specification. Your Profile You are best equipped for this task if you have: Bachelor\'s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics (Physics) At least 3 years of working experience in semiconductor assembly and packaging development and relevant experience in leadframe/packing material is preferred Experience in drafting/designing (2D/3D) leadframe using AutoCAD/Inventor Knowledge in material physics/properties for leadframe and packing material GD&T knowledge/material specification definition Analytical and problem solving skills Basic semiconductor packaging, assembly and test knowledge is a plus Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.

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