Job Description

Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.

Infineon Technologies (Malaysia) Sdn Bhd, with its 8.000 employees, is the largest manufacturing site of Infineon. The company has established itself as a leading manufacturing site for Power Semiconductors, Logic Semiconductors, Discrete and Sensor Products. We are committed to increasing productivity, on-time delivery and providing customized solutions while maintaining the highest level of product quality. The success of Infineon Melaka is evidenced by eleven National Awards received from the Prime Minister\'s Office as well as 15 corporate awards.

In your new role you will:

• Test Scan Pack (TSP) handling platform equipment development
• Responsible for execution and establish test scan pack handling capability for new packages
• Develop test handling capability for new packages as part of the ItP project and following ItP & TE milestone
• Source and benchmark new test cell (test scan pack handler / change kit / docking / vision system / laser marker) in terms of quality, performance, time to market and cost
• Develop and execute qualification plan for test cell - qualify and implemment new TSP into production according to standard business process (e.g.: T32, ERB)
• Monitoring performance, quality and reliability of new TSP to ensure equipment procurement specification are met
• Documentation of standard equipment release document
• Drive improvement programs on TSP performance for existing and new packages (e.g: MTBA / MTBF, PPJ, Disabled sites)

• Masters/Bachelor Degree in engineering fields (Electrical / Electronic / Mechanical / Mechatronic / Robotics / Automation or related engineering fields)

Infineon