Sustains and continuously improves qualified technologies in volume production with regards to stability, quality, productivity and yield
Leading and participating in yield & quality improvement and cost reduction activities
Support on auditing activities
Your profile You are best equipped for this task if you have:
Bachelor degree in Electronic, Mechanical or related Engineering
More than 3 years related experience in Assembly packaging or Semiconductor manufacturing background
Wire Bond Process
First level reliability (Knowledge of various failure modes, knowledge of application and respective reliability requirements and test standards)
Data Analysis (Statistical methods, data mining, etc)
Productivity/process improvement
Driving decarbonization and digitalization. Together.
Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.
Infineon Technologies (Malaysia) Sdn Bhd, with its 8.000 employees, is the largest manufacturing site of Infineon. The company has established itself as a leading manufacturing site for Power Semiconductors, Logic Semiconductors, Discrete and Sensor Products. We are committed to increasing productivity, on-time delivery and providing customized solutions while maintaining the highest level of product quality. The success of Infineon Melaka is evidenced by eleven National Awards received from the Prime Minister\'s Office as well as 15 corporate awards.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!