Job Description

In your new role you will: * Responsible for technical support of new product/package/process development. * Ensure that the project meets customer requirements in terms of timeline, cost and quality. * Provide design proposa In your new role you will: Responsible for technical support of new product/package/process development. Ensure that the project meets customer requirements in terms of timeline, cost and quality. Provide design proposal for package, lead frame, substrate and Cu-clipof new products. Close interaction with the project manager, subcon interface, chip designer, application team, marketing and business units for new product design and project roadmaps. Provide technical direction related to problem solving of process and reliability issues. Closure of Package Development related deliverables and documents. Your ProfileYou are best equipped for this task if you have: Master/Bachelor Degree in Engineering and Physical Science Experience in semiconductor package development. Experience in package development with Outsourced Assembly and Test (OSAT) Subcontractor is an advantage. Experience in analytical tools: Delta Analysis, DFMEA, DoE, 8D and simulation. Proficient in AutoCAD for 2D drawing. Knowledge using 3D software (e.g. AutoCAD 3D, Inventor, and SolidWorks) is an advantage. Knowledge of package design rules. Knowledge of industry standards for package reliability test and qualifications. Can interpret package simulation results. Knowledge in package simulation software (e.g. ANSYS, SolidWorks) for FEA & thermal analysis is an advantage. Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.

Monster