Job Description

Location: Melaka
Job ID: 348755

Job description
In your new role you will:

• Drive a Project & Packaging team for new package development from

development process post concept approval to launch * Drive Subcon team from development process post concept approval to launch

• Be responsible to ensure all new package development is within timeline, budget and

technical & Quality standards are achieved to maximize profitability * Bring team together to ensure proper project execution within team members, BU partner and other interfaces (Internal Infineon team & external subcon team)

• Manage package development execution within product/ technology development according to project milestone, quality & cost requirements (Project complexity could be from Class E up to Class C)
• Align with chip/ system development, test engineering for all technical, cost and quality aspects during project phase
• Support Package Definition group to ensure package platform complexity, product

requirement and customer commitment are met * Conduct problem solving and trouble shooting of development issues

• Be responsible for samples, qualification build-up & transfer into manufacturing engineering
• Act as the Communication channel of dedicated project in BE to requestor (e.g. Project Owner, PJM of Product Line, Package group PCK of Product Line, BE Management, Steering committee)
• Be responsible for regular KLUSA reporting and milestone release in NPI Tool
• Be reporting project progress to Project Owner / PJM of PL and/ or development board in BE OSAT

Your profile
You are best equipped for this task if you have:

• Master/ Bachelor Degree of Engineering and Physical Science
• Minimum 6 years of relevant working experience and there of 4 years of leading projects
• Experience in semiconductor R&D in packaging group
• Very good project management knowledge in terms of project initiation, planning and closing including reporting and documentation
• Analytical mind and high initiative to challenge him/ herself and the team to move the next level of competency
• Experience in analytical tool, e.g. Surface analysis, material characterization, DoE, D/

PFMEA, 8D and simulation knowledge will be an added advantage * IP management, e.g. patent filing
Part of your life. Part of tomorrow.

Infineon is a world leader in semiconductor solutions that make life easier, safer, and greener. Our solutions for efficient energy management, smart mobility, and secure, seamless communications link the real and the digital world.

Infineon Technologies (Malaysia) Sdn Bhd, with its 8.000 employees, is the largest manufacturing site of Infineon. The company has established itself as a leading manufacturing site for Power Semiconductors, Logic Semiconductors, Discrete and Sensor Products. We are committed to increasing productivity, on-time delivery and providing customized solutions while maintaining the highest level of product quality. The success of Infineon Melaka is evidenced by eleven National Awards received from the Prime Minister's Office as well as 15 corporate awards.

Does this sound like just the right challenge for you? If so, we look forward to getting to know you!

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