In your new role you will: Responsible for PBC and TPC assessment. Be the owner of Risk Interaction assessment and mitigation work packages Integration ownership of Pre-development for new Chip technology that involved multiple platforms. Harmonise the Integration of unit processes (BOM and Process) and new chip technology involving different package platforms,. Be the working partner for FE in FE/BE interaction and integration topics. Be the driver/team member for 8D/problem solving for interaction issues. Drive synergy, best practice implementation and sharing of lesson learnt across platforms. Provide Technical guidance/assistance when needed in the projects related to interaction topic Your Profile You are best equipped for this task if you have: Bachelor\'s Degree in Engineering (Semiconductor Technology ,Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) At least 6 years of working experience in IC/semiconductor environment. Semiconductor Packaging, Assembly and Test knowledge Good aptitude for communication, collaboration, negotiation and solution finding Internal Package analysis/ first level reliability Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.
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