Job Description

Location: Melaka, Ipoh
Job ID: HRC0844930Job description
In your new role you will:

• Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time-to-market, product quality level, process capability and assembly yield target.
• Responsible for package definition tasks in the OSAT segment in defining project complexity definition with Delta assessment list, project category assessment and performing project risk assessment with mitigation actions.
• Responsible for integration of unit processes till process freeze for assembly and test at subcons which entails creating assembly specifications, marking instructions and packing specifications for upload into the Database.
• Apply and verify design rules based on established baseline documents as well as specific equipment and process capability of specific assembly sites. This includes the OSAT technical capability assessment role.
• Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre-development.
• Responsible for enabling new package platforms and derivativespackages, and support of technology and package development at OSAT.This includes a new subcon enabling support role.
• Be the driver or co-driver for platform-related Task force activities.

Your profile
You are best equipped for this task if you have:

• Master or Bachelor degree in Engineering disciplines.
• Minimum 7 years\' working experience in package development in New introduction or process (Pre-assembly, assembly and test) and 3 years in supporting project management
• Experience in Module assembly, Wafer level package (WLP), bumping,eWLB and System in Package (SiP) will be a key advantage.
• Good knowledge of process and material in both laminates andleadframe packages and interaction to the different functions (laminate/ leadframe design, design rules, process).
• Good understanding of quality requirements / release criteria (e.gJEDEC/AEC grade) that fits and match to product/package design and BOMsets selection.
• Strong analytical skills, ability to deal with conflict. Live up tohigh quality standards. Good quality mind-set and excellent problemsolving.
• Strong in communication and people interpersonal skills across all levels. Experience in Subcon management.

Driving decarbonization and digitalization. Together.Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant\xc2\xb4s experience and skills.Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.Does this sound like just the right challenge for you? If so, we look forward to getting to know you!(It only takes 90 seconds)

Infineon