Work with wafer fabrication device engineering to address process-related defects
Work with application & designer engineering on customer application failure and with Quality Engineering towards issue resolution with 8D response.
Work with factory engineering to resolve product manufacturing issue, BOM setups, product flow definitions and devise appropriate evaluation and reliability assessment plan for maverick materials disposition
Perform device characterization and evaluation for above and other continuous improvement activities.
Use state of art statistical analysis tools to drill down the root cause of product failure and identify resolution for process or program improvement.
For NPI, work with design, test and wafer fab device engineering to validate, debug, qualify and characterize newly designed from 1st silicon and support qualification to volume production ramp.
Optimize test program including Final Tests & probe programs
Work with designers and module owners to improve the test coverage or optimize the test methodology to improve both the product cost and quality.
Requirements:
Master's/Bachelor's degree in Electronics/Electrical Engineering or Applied Physics with minimum 5 years of IC product engineering experience
Demonstrate experience on product yield & cost improvement
Demonstrate knowledge of device, Uflex, J750, Verigy test programs, applications and some wafer fabrication and failure analysis knowledge
Demonstrate knowledge & application of statistical process controls & DOE
Knowledge of Microcontroller or Microprocessor basics preferred
Strong written and verbal communication skills
Team player with Leadership ability to drive projects to completion.
High degree of flexibility in work assignments
High level of discipline and commitment to job, possess high career aspirations.
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