Job Description

In your new role you will: Contribute in the definition of general package design & drafting methods (Package design methods, tools and documentation, Package design work flow) for global BE DEV. Contribute in the generation of conceptual package design/construction method guidelines and work instruction documents, finalize the documents and roll-out to the global BE DEV organizations as needed. Contribute in the deployment of latest package design/construction tools & methods to the global package designer community in alignment with BE management. Support of A-Projects of BE DEV MAL by 3D-based package design/construction service using latest tools & methods. Contact partner and technical consultant for BE DEV package definition and Business Division especially on BE design & drafting method and process know how. Support pre development & project definition stage, and continue to be package design. Your Profile You are best equipped for this task if you have: Bachelor\'s Degree in Engineering (Mechanical, Electrical, SemiconductorTechnology, Microelectronics, Electronics, Physics). At least 3 years of relevant working experience in IC/semiconductor environment. Experience working in Semiconductor Packaging, Assembly and Test area. 3D mechanical construction & drafting knowledge (Inventor or SolidWorks), Programming Language (e.g. C, VBA, Python) knowledge. Mechanical Construction Standards knowledge. Experience in process or equipment engineering will be added advantage. Analytical and Problem Solving Skills. Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.

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