Perform IC (complex functional) Failure Analysis [FA] on wafer and package level from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
Participate, lead and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings.
FA equipment / tool ownership.
Interface with designers, test, product, process integration and unit process engineers to understand the analysis requirement.
Identify development opportunity of new EFA techniques and improvise FA skills and techniques to enhance analysis quality, speed and cost.
Responsible for achieving EFA KPIs.
Your profile
You are best equipped for this task if you have:
Complex Electrical Failure Verification and Localization, i.e. scanlogic , Hi-Level Tester, SDL analysis
Imaging, i.e. optical, SEM and FIB (incl. Voltage Contrast).
Repackaging skill i.e. COB
CAD Navigation plus Cross Mapping Schematic, Software Diagnosis on Logic FA
Circuit troubleshooting via micro probing (A-pad, FIB pad or AFP)
Part of your life. Part of tomorrow.
Infineon is a world leader in semiconductor solutions that make life easier, safer, and greener. Our solutions for efficient energy management, smart mobility, and secure, seamless communications link the real and the digital world.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!