Job Description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.
Full responsibility to design, optimize, and maintain efficient, safe, and sustainable processes within manufacturing. Full process ownership on quality, yield, damage containment, process capability and stability, cost, CpK and other related KPIs. Lead and drive Continuous Improvement Projects (CIP) to enable cost reduction, capacity expansion, yield and performance enhancement to enable the production of Best-In-Class LED chips at competitive cost. Lead process transfer, process & tool qualification and ramp related projects. Constantly align with Regensburg counterparts to ensure synchronization between sites. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to safety & quality standard to meet legal & customer requirements. Perform risk assessment and derive necessary control to keep process stable. Owner of PFMEA, control plan and working instruction. Lead Customer/Certifying Body Audits. Provide direction for process and equipment strategy with procurement spec for equipment purchases. Provide training to engineers, technicians, manufacturing specialists. Provide technical leadership, guidance & consultancy on process engineering topics with cross-functional teams (Production, Process & Integration, Quality, Industrial Engineering, EHS, IT, Facility, Quality, Fab Management)

Preferably PhD, Master, Bachelor Degree of Engineering / Science. Min 8 years of front-end semiconductor wafer fabrication equipment working experience. Min 8 years of experience and competency in manufacturing, process engineering, product or process development. Experience in leading cross-functional teams (process & equipment engineering, production). Ability to work effectively in cross-cultural multi-national working environment & organization. Front-end wafer fabrication process/equipment/material engineering/manufacturing. Skilled in OEE, SPC, FDC, 8D problem solving, FMEA, DMAIC, TWI, semiconductor related Digital Manufacturing and Automation. * Fluency in English and Bahasa Malaysia.