Job Description

We are seeking experienced Supervisors to support our company's rapid expansion in semiconductor assembly. The successful candidate will oversee daily operations, ensure smooth execution of processes, and lead a team to achieve production, quality, and efficiency targets in their assigned package area.

Supervise and coordinate activities in semiconductor assembly for the assigned area:

Pre-Assembly Assembly (SO, QFN, DFN, etc.) - Diebond, Wirebond, etc. Power Package (TO, PAK, etc.)
Monitor production output to meet delivery schedules, quality standards, and yield targets.

Drive continuous improvement initiatives for process stability, equipment utilization, and workforce productivity.

Ensure compliance with safety, EHS, and quality requirements.

Provide coaching, training, and performance management for operators and technicians.

Collaborate with engineering, maintenance, and quality teams to resolve process and equipment issues.

Job Requirements

Minimum 5 years of experience in the semiconductor industry, with at least ~3 years in the relevant package/process area.

Strong technical knowledge in die attach, wire bonding, moulding, or power package assembly.

Proven leadership and people management skills.

Good problem-solving, communication, and cross-functional collaboration abilities.

Willingness to work in a high-volume manufacturing environment.

Job Type: Full-time

Pay: RM3,000.00 - RM5,000.00 per month

Experience:

semiconductor: 5 years (Preferred)
Work Location: In person