Job Description

Primary Function:

To perform PFD lacquer & Potting machine TPM program and trouble shooting for newly setup line

Ensure machines are calibrated to the specification requirement for production.

Ensure production machine performance is well maintained.

Assist process/equipment engineers to carry out or set up new device evaluation/engineering runs when needed.

Maintain and perform troubleshooting on assigned operations.

Minimum Qualification

:

Diploma in related discipline

min 2 years relevant working experience.

Dynamic personality and good interpersonal skills.

Experience in semiconductor experience.

Able to work on normal or 12 hours rotating shift.

Principal Responsibilities

:

Support equipment set up & conversion for all equipment in Wire Bond process.

Support PM group for PM activities where necessary

Perform troubleshooting for daily breakdown machine and monitor machine performance after repair, installation, upgrade & modification.

Perform root cause analysis and process mapping for line quality issue.

implement containment actions and feedback to superior for further actions.

Job Type: Full-time

Pay: RM1,750.58 - RM2,860.96 per month

Benefits:

Health insurance Maternity leave Opportunities for promotion
Work Location: In person