Job Description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.
Equipment Maintenance & Troubleshooting:

Perform preventive and corrective maintenance on wire bonders (e.g., Shinkawa, ASM, etc.). Diagnose and resolve equipment-related issues to minimize downtime. Lead root cause analysis (RCA) for recurring failures and implement corrective actions.

Process Optimization:

Optimize wire bonding parameters (e.g., force, ultrasonic power, temperature) to improve yield and throughput. Conduct DOE (Design of Experiments) to enhance process stability and performance. Work with process engineers to qualify new materials (wire types, capillaries) and bond pad designs.

New Equipment & Technology Development:

Evaluate and qualify new wire bonding equipment and technologies. Lead installation, commissioning, and validation of new bonders. Develop and document Standard Operating Procedures (SOPs) and best-known methods (BKMs).

Yield & Quality Improvement:

Analyze bond strength, pull test data, and shear test results to ensure quality standards. Collaborate with quality and reliability teams to address bond-related defects. Implement SPC (Statistical Process Control) to monitor process stability.

Cross-functional Collaboration:

Work with production, process integration, and R&D teams to meet product requirements. Support failure analysis (FA) for wire bond-related issues in packaged devices. Train technicians and junior engineers on equipment operation and maintenance.

Continuous Improvement & Cost Reduction:

Identify opportunities to improve equipment uptime, cycle time, and consumable lifespan. Drive cost-saving initiatives through process optimization and vendor collaboration.

Bachelor's/Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field. 5+ years of hands-on experience with wire bonding equipment in semiconductor assembly/packaging. Proficiency in wire bonder platforms (Shinkawa, ASM,K&S etc.) and bonding technologies (ball bonding, wedge bonding). Strong understanding of metallurgy, intermetallic formation, and wire bond reliability. Familiarity with SEMI standards, cleanroom protocols, and ESD controls. Strong problem-solving and analytical skills (8D, FMEA, Fishbone). Excellent communication and teamwork abilities. Project management experience (Lean Six Sigma certification is a plus). Experience with Au wire bonding, Ag sintering. Knowledge of automation (SECS/GEM, HSMS) and data analysis tools (JMP, Python, SQL). * Cleanroom/manufacturing setting with occasional overtime to support production needs.