Job Description

MalaysiaJob details Posted 19 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1721349295Wire Bond Process Development ManagerJob descriptionOur client is a rapidly expanding semiconductor MNC in Melaka. Due to rapid expansion, they are currently seeking a Wire Bond Process Development Manager.Key Responsibilities:

• Lead the development and optimization of wire bonding processes, including process design, equipment selection, and material evaluation.
• Manage a team of engineers and technicians to ensure successful execution of wire bond process projects.
• Collaborate with cross-functional teams, including design, quality, and production, to drive process improvements and resolve technical issues.
• Establish and maintain process documentation, including process flow diagrams, standard operating procedures (SOPs), and control plans.
• Conduct rigorous process characterization and validation to ensure robust and repeatable wire bonding processes.
• Implement continuous improvement initiatives to enhance process efficiency, yield, and reliability.
• Stay current with industry trends, advancements in wire bonding technologies, and emerging best practices.
• Provide technical support and training to production staff to ensure proper execution of wire bonding processes.
• Lead root cause analysis and corrective action activities for process-related defects and failures.
• Oversee the introduction of new wire bonding equipment and technologies into the production environment.
• Develop and manage project plans, budgets, and timelines to meet company goals and objectives.

Skills & Experience Required:

• Bachelor\'s or Master\'s degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
• Minimum of 5-7 years of experience in wire bonding process development within the semiconductor industry.
• Proven track record of successfully developing and optimizing wire bond processes for semiconductor packaging.
• Strong leadership and team management skills, with the ability to mentor and develop engineering talent.
• In-depth knowledge of wire bonding equipment, materials, and techniques.
• Excellent problem-solving skills and the ability to apply structured methodologies for root cause analysis and process improvement.
• Experience with statistical process control (SPC), design of experiments (DOE), and other process optimization tools.
• Familiarity with industry standards and quality systems, such as ISO 9001, IATF 16949, or similar.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn\'t quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobWire Bond Process Development ManagerMalaysia Posted about 2 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.

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