Wire Bond Process Engineer

Bayan Lepas, M07, MY, Malaysia

Job Description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.
Responsible for line sustaining issues & full accountability of outgoing yield and quality of Wire Bond process. KPIV, KPOV & LoD are key. Updating documentation on a timely manner (FMEA, WI, POCAP, CP, Build sheet...etc) Hands on & run the equipment/process in production mode. Expected to spend time on the production floor daily Equip with wire bond process knowledge through self-learning and able to do some minor troubleshooting whenever there are any quality/maverick issues occur Work closely with cross functional team like equipment, PO & Quality team on any issues arise Work closely with R&D for new product development to ensure robust process & manufacturability. Support new product pre-series and ramp-up Initiate cost & yield improvement projects which may need to drive the upstream process on any incoming quality deviations

Min Bachelor's Degree in Electrical / Electronics / Mechanical Engineering or equivalent Preferred with min 8 years working experience in High Volume Manufacturing and Complex process for IC or LED manufacturing Experience in the Wire Bond process is highly preferred 6 Sigma Methodology, Green/Black Belt is an advantage Process control knowledge-Control Plan, FMEA, SPC, MSA, 8D, DOE, Minitab, PBI * Proficient speaking & writing in English

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Job Detail

  • Job Id
    JD1150857
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Bayan Lepas, M07, MY, Malaysia
  • Education
    Not mentioned