Wire Bond Process Engineering Manager

Melaka, Malaysia

Job Description


  • Responsible for organization's manufacturing assembly processes (wire bond), define product assembly procedures and FMEA.
  • Initiate, direct, and coordinate through the efforts of the process engineering group all process activities to ensure optimum use of workers, equipment, materials, and facilities.
  • Continue improvement for the Yield and Quality year to year for better cost structure.
  • Drive and guide a group of process Engineers to achieve company goal and objective.
Job Responsibilities
  • Work with R&D team; direct and coordinate the process engineering group activities in the design, development, implementation and improvement of systems, processes, and product assembly procedures.
  • Provide planning, direction, and coordination for all process activities to ensure optimum use of workers, equipment, materials, and facilities.
  • Plan and establish process engineering projects and follow up on performance against estimates.
  • Initiate cost reduction proposals, compile appropriate information, make recommendations for action, and confirm results obtained.
  • Manage, through process and procedure, the implementation of product design changes
  • Responsible for the identification, source selection, installation, validation, training, and implementation of new equipment and new processes.
  • Ensure active consultation with new product development teams regarding manufacturing capabilities and issues related to design for manufacturability, test, and assembly.
  • Assist in the preparation of new product cost estimates.
  • Define the technical training in manufacturing techniques, methods and processes provided to manufacturing associates.
  • Actively seek knowledge of new manufacturing technologies, methods, and techniques.
  • Ensure compliance of company policies, procedures, and objectives regarding processes, initiatives, and projects.
  • Continue improvement project to drive for yield and quality.
  • Coordinate and work with Quality team for the customer complaint and customer visit.
Competency Requirement
  • At least a Bachelor's Degree in Electrical, Electronic, Mechanical or related disciplines
  • More than 15 years working experience, preferably with 5 years of supervisory experience in semiconductor industry (Wire bonding process)
  • Ability to lead and coach a team of more than 10 WB engineers
  • Familiar with Management System, coretools, statistical techniques, equipment & tools knowledges and troubleshooting skills
  • Good communication and interpersonal skills
  • Presentation Skills
  • Must be willing to work in Melaka
Interested candidates please reach out to Gan at gan@asiarecruit.com.my or 017-6700722Only shortlisted candidates will be notified.Agensi Pekerjaan Asia Recruit Sdn Bhd (200401036859) (675370-W) (JTKSM 230C)

Asia Recruit

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Job Detail

  • Job Id
    JD1086279
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Melaka, Malaysia
  • Education
    Not mentioned