Job Summary: The COB Sub Assembly Engineer is responsible for developing, implementing, and optimizing Chip on Board (COB) processes, including Die Bonding…
MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
This is WorldlineWe are the innovators at the heart of the payments technology industry, shaping how the world pays and gets paid.…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
MalaysiaJob details Posted 16 October 2024 SalaryRM6000 RM8500 per month LocationKlang Job type Discipline Reference276753_1729060046ConsultantConsultant, EngineeringSenior Operations EngineerJob descriptionOur client is a…
Genting Malaysia BerhadGenting Malaysia is a leading multinational conglomerate that is principally involved in the leisure and hospitality business, covering theme parks,…
At least Diploma in Packaging Design and Technology or any other relevant field. Knowledge of Computer Aided Design (CAD) software (preferrable AutoCad,…
Company DescriptionThe future. Its on you. You & Western Digital.Weve been storing the worlds data for more than 50 years. Once, it…
Location:, ,Salary:CompetitiveType:PermanentMain Industry:Advertiser:Job ID:130950174Posted On:14 August 2024Genting Malaysia BerhadGenting Malaysia is a leading multinational conglomerate that is principally involved in the leisure…
MalaysiaJob details Posted 16 October 2024 SalaryRM6000 RM8500 per month LocationKlang Job type Discipline Reference276753_1729060046ConsultantConsultant, EngineeringSenior Operations EngineerJob descriptionOur client is a…
Location:Kuantan (26080) Salary:CompetitiveType:PermanentMain Industry:Other Industries & Skills:Purchasing & Supply ChainAdvertiser:Job ID:131057794Posted On:06 September 2024Sealed Air designs and delivers packaging solutions that protect…
MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading semiconductor company…
Location: Senai i ParkJob Summary:We are the global leader in sleep technology and our devices transform care and lives for people with…
Company DescriptionThe future. It\'s on you. You & Western Digital.We\\\'ve been storing the world\'s data for more than 50 years. Once, it…
Company DescriptionAt Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can…
MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1726550432Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
Plant Engineer (based in Senai, Johor)Summary:.The position is to be responsible for all engineering and technical disciplines that involves from raw material…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur client is…