This is WorldlineWe are the innovators at the heart of the payments technology industry, shaping how the world pays and gets paid.…
Job Role: Perform signal integrity (SI) simulations and modeling for chip, package, and board level interconnects, covering high speed interfaces such as…
MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor company in…
Job Summary: The COB Sub Assembly Engineer is responsible for developing, implementing, and optimizing Chip on Board (COB) processes, including Die Bonding…
MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
This is WorldlineWe are the innovators at the heart of the payments technology industry, shaping how the world pays and gets paid.…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
MalaysiaJob details Posted 16 October 2024 SalaryRM6000 RM8500 per month LocationKlang Job type Discipline Reference276753_1729060046ConsultantConsultant, EngineeringSenior Operations EngineerJob descriptionOur client is a…
Murata America Location: Ipoh Salary: Competitive Type: Permanent Main Industry: Advertiser: Job ID: 131967529 Company: Murata America Posted On: 04 June 2025…
Murata America Location: Ipoh Salary: Competitive Type: Permanent Main Industry: Advertiser: Job ID: 132077536 Company: Murata America Posted On: 11 July 2025…
Murata America Location: Ipoh Salary: Competitive Type: Permanent Main Industry: Advertiser: Job ID: 132062946 Company: Murata America Posted On: 07 July 2025…
Murata America Location: Ipoh Salary: Competitive Type: Permanent Main Industry: Advertiser: Job ID: 132060123 Company: Murata America Posted On: 05 July 2025…
Summary Salary: Competitive Team: Operational Engineering Location: Malaysia Global Development Campus, Johor BahruGraphics & Packaging Operations EngineerSummarySalary: CompetitiveTeam: Design and DevelopmentLocation: Malaysia…
pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductors 30 year legacy of technology advancements and strong…
Murata America Location: Ipoh Salary: Competitive Type: Permanent Main Industry: Advertiser: Job ID: 132028903 Company: Murata America Posted On: 25 June 2025…
Murata America Location: Ipoh Salary: Competitive Type: Permanent Main Industry: Advertiser: Job ID: 132041194 Company: Murata America Posted On: 30 June 2025…
Murata America Location: Ipoh Salary: Competitive Type: Permanent Main Industry: Advertiser: Job ID: 132044989 Company: Murata America Posted On: 01 July 2025…
Murata AmericaLocation:Ipoh Salary:CompetitiveType:PermanentMain Industry:Advertiser:Job ID:131958937Company:Murata AmericaPosted On:01 June 2025pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductors…
Seeking a highly motivated and experienced Advanced Packaging Process Engineer to drive the development and optimization of cutting edge packaging technologies for…
Seeking a highly motivated and experienced Advanced Packaging Process Engineer to drive the development and optimization of cutting edge packaging technologies for…