\ Malaysia Job details Posted 18 January 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1705541484 Die Bond Equipment Engineer Job description This rapidly…
\ \ MalaysiaJob details Posted 13 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1715569407Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly…
\ \ Job Description In your new role you will: Yield improvement activities for Die Attach process Sustain and achieve stability index…
\ \ Category (For Job Seekers) Manufacturing/Operations Location 55831 MSI 5583 Penang Penang, 11900 MY (Primary) Job Description Production Test Technician 2…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ \ Category (For Job Seekers) Manufacturing/Operations Location 55831 MSI 5583 Penang Penang, 11900 MY (Primary) Job Description Production Test Technician 2…
\ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: Good discipline and behavior, willing to learn and grow. Shift technician support production to achieve…
\ Manufacturing Technician 2 Description Applies basic knowledge of the job skills and company policies and procedures to complete a variety of…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ \ Location: Melaka Job ID: HRC0747472Job description In your new role you will: Yield improvement activities for Die Attach process Sustain…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…
\ \ Job Description In your new role you will: Quality improvement activities on DDM investigation, disposition and improvement Yield improvement activities…
\ \ Location: Melaka Job ID: HRC0728671Job description In your new role you will: Quality improvement activities on DDM investigation, disposition and…
\ Category (For Job Seekers) Engineering Location 55831 MSI 5583 Penang Penang, 11900 MY (Primary) Job Description Manufacturing Equip Maint Technician 2\…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Malaysia Job details Posted 12 September 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1694500453 Die Bond Equipment Engineer Job description This rapidly…