\ Company Overview: \ People power our future. That is why advancing a dynamic, inclusive environment, where everyone grows and thrives is…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1732267956Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference276992_1732265088Principal Failure Analysis EngineerJob descriptionOur client is a global Semiconductor company…
\ Your Contribution Responsible for Lean Six Sigma Transformation vision, strategy and culture. Work closely with Lean Six Sigma Principle Engineer to…
\ Malaysia Job details Posted 12 September 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1694500453 Die Bond Equipment Engineer Job description This rapidly…
\ \ Our people are \ ambitious and humble, believing in what they do and convinced that our purpose is \ shaping…
\ Malaysia Job details Posted 18 January 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1705541484 Die Bond Equipment Engineer Job description This rapidly…
\ \ Agensi Pekerjaan BTC Sdn Bhd Location: Bayan Lepas (11900) Salary: IT, Information Technology, Business Analyst, Insurance, Banking, Financial Institution, UAT,…
\ \ Join Nexperia and connect your unique talents and passion to your goals for a fulfilling career with growth and reward.…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryNegotiable\ \ \ LocationSelangor\ \ \ Job type Permanent…
\ \ Do you dream of working in a company that is driven by a meaningful purpose? An inclusive company that empowers…
\ Company BackgroundWe are representing world known company with a global footprint that provides high performance, semiconductor based power electronic solutions. As…
\ \ MalaysiaJob details Posted 13 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1715569407Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable…
\ DetailsPOSITION : Senior Engineer, Process & Flow AssuranceREPORTING TO : Head of Sarawak Operations SupportDIVISION/DEPARTMENT : Sarawak Operations Support (PBK/O)LOCATION :…
\ Job Description:Company Overview:People power our future. That is why advancing a dynamic, inclusive environment, where everyone grows and thrives is critically…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Die Bond Development Engineer who specializes in Soft…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…