Location:Penang Salary:CompetitiveType:PermanentMain Industry:Other Industries & Skills:Information TechnologyAdvertiser:Job ID:131575800Posted On:07 February 2025Purpose Statement: Strategic manager of multiple product lines, technologies, or specialized functions.…
Flex is the diversified manufacturing partner of choice that helps market leading brands design, build and deliver innovative products that improve the…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
\ Req ID: 117789 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream:…
\ Job Description In your new role, you will: Sustains and continuously improves qualified technologies in volume production with regards to stability,…
\ Job Description In your new role you will: Develop and realize process & maintenance concepts. Support new product & equipment for…
\ Req ID: 118832 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream:…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Location: Melaka Job ID: HRC0417195 Job description In your new role, you will: Sustains and continuously improves qualified technologies in volume…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…
\ Location: Melaka Job ID: HRC0472631 Job description In your new role you will: To drive wire bond planned maintenance systematic &…
\ Req ID: 118832 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream:…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…