Job Description

Job Functions:

The Clip Bond Engineer is responsible for developing, optimizing, and sustaining clip bonding processes used in semiconductor packaging. This role focuses on ensuring high-quality interconnections, improving yield, and supporting production through process control, troubleshooting, and continuous improvement.

Key Responsibilities:

Develop, optimize, and maintain clip bonding processes for semiconductor packages Set up, qualify, and troubleshoot clip bonding equipment and materials Monitor process performance, yield, and reliability; implement corrective actions Conduct DOE, root cause analysis, and failure analysis for bonding-related issues Support new product introduction (NPI), process transfer, and mass production Collaborate with cross-functional teams (R&D, Quality, Production, Suppliers) Prepare process documentation, SOPs, and technical reports Ensure compliance with quality, safety, and industry standards

Requirements / Qualifications:

Bachelor's degree in Engineering (Electrical, Mechanical, Materials, or related field) Experience in semiconductor packaging or assembly (clip bond, wire bond, die attach preferred) Knowledge of bonding materials, equipment, and reliability testing Strong analytical and problem-solving skills Familiar with SPC, DOE, FMEA, and quality tools Good communication skills and ability to work in a team
Job Types: Full-time, Permanent

Pay: RM4,000.00 - RM6,262.96 per month

Benefits:

Maternity leave Opportunities for promotion Professional development
Work Location: In person