Job Description

Job Summary

Develop, optimize and implement robust wire bonding processes for new semiconductor product. This includes developing process parameters, troubleshooting defects, ensuring quality and yield, managing documentation and collaborating with equipment engineers to ensure successful product introductions.

Key Responsibilities

Determine the optimum process condition through comprehensive evaluation to supply best quality. Perform process characterization through Design of Experiments (DOE) to ensure robustness and reliability. Identify and resolve wire bonding issues, perform root cause analysis on defects, and implement continuous improvement (PDCA) for quality key indicators. Create, update and maintain manufacturing documentation, such as wire bonding recipes, technical reports and process specifications.

Qualifications

Qualifications and Skills

Education background: Bachelor's degree in engineering - Mechanical / Electrical / Electronics/ Mechatronics / Semiconductor Technology or equivalent.


Technical Skill:


Experience: Prior experience (2+ years) in semiconductor industry, especially with new product introduction, is preferred


Ability to handle operation and recipe making of wire bonder machine model K&S and Shinkawa, is preferred

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose '

To Make Our Lives Easier

.' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.



With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, '

To Make Our Lives Easier

.'



At Renesas, you can:

Launch and advance your career

in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.

Make a real impact

by developing innovative products and solutions to meet our global customers' evolving needs and help make people's lives easier, safe and secure.

Maximize your performance and wellbeing

in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?


Join Renesas. Let's

Shape the Future

together.


Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our

Diversity & Inclusion Statement

.


We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning.

Job title

Wire Bond Process Engineer

Department

Manufacturing

Location

Telok Panglima Garang

Remote

No

Requisition ID

20022233_2025-09-12