Die Bond Technician (ampang)
Ampang, M10, MY, Malaysia
Job Description
JOB VACANCIES
Position : Die Bond Techinician
Salary : RM 2000 up to 3500
Status : Permanent
Provide : Medical, Kwsp, Socso, EIS,AL, ML, HL
Working Hour:
2 shift Monday to Saturday 8 am to 8 pm (inlcude OT) 8pm to 8 am (include OT) Offday / Restday : Alternate Night Allowance
Requirements:
Education - Dip / Certificate in Mechanical (Mold & Die) Possess a reasonable working knowledge in the related practices in the industry Able to use computer and familiar with MS Office Good communication & interpersonal skills Applicants must be willing to work in Sungai Way Petaling Jaya
RESPONSIBILITES:
Define the process window Good in problem solving and work on the Root Cause Analysis/Finding Work closely with development team Ensure smooth transition from Development to new product qualification phase. Work closely with manufacturing process and equipment team Report any non-conformance/customer complaint issue and develop/follow up the improvement actions.
Additional Information
:Interview will be arrange on this Friday and onwards. Please do not hesitate to whatsapp me : 0129970466
Job Types: Full-time, Permanent, Fresh graduate
Pay: RM2,000.00 - RM3,500.00 per month
Benefits:
Free parking Opportunities for promotion Parental leave Professional development
Application Question(s):
Education?
Work Location: In person
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Job Detail
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Job IdJD1282184
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationAmpang, M10, MY, Malaysia
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EducationNot mentioned