Die Bond / Wire Bond Process Development Senior Staff Engineer
Bayan Lepas, Penang, Malaysia - OSRAM OS Penang
What we expect
Develop or optimize Die Bond and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
Participate and support FOL processes tehcnology roadmap and building block activities.
Equipment selection which meet project cost, quality and timeline target.
Share and transfer technical know how within R&D and to Manufacturing team.
Provide technical guidance or job coaching to junior supporting staff.
Participate in engineering sample, pre-series and ramp-up build to fulfill custoemr order.
Who we are looking for
Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
> 5 years of experience in semiconductor field.
> 5 years of experience in Die Bond and Wire Bond processes.
Process egnineering knowledge in semiconductors or LED manufacturing processes.
Knowledge in process development step and statistic.
B. Minitab knowledge will be advantage.
Six Sigma Green or Black Belt will be advantage.
ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.
Contact
Nurul Ain Rosli will be happy to answer any questions you may have.
E-Mail: nurul-ain.rosli@ams-osram.com
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Job details
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