Die Bond / Wire Bond Process Development Senior Staff Engineer
Job Description
The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.
Develop or optimize Die Bond and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
Participate and support FOL processes tehcnology roadmap and building block activities.
Equipment selection which meet project cost, quality and timeline target.
Share and transfer technical know how within R&D and to Manufacturing team.
Provide technical guidance or job coaching to junior supporting staff.
Participate in engineering sample, pre-series and ramp-up build to fulfill custoemr order.
Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
> 5 years of experience in semiconductor field.
> 5 years of experience in Die Bond and Wire Bond processes.
Process egnineering knowledge in semiconductors or LED manufacturing processes.
Knowledge in process development step and statistic.
B. Minitab knowledge will be advantage.
* Six Sigma Green or Black Belt will be advantage.
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Job Detail
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Job IdJD1318622
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationBayan Lepas, M07, MY, Malaysia
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EducationNot mentioned