Die Bond Technician (ampang)
Ampang, M10, MY, Malaysia
Job Description
Position : Die Bond Techinician
Location : Ampang KL.
Salary : up to 3800++
Status : Permanent
Provide : Medical, Kwsp, Socso, EIS, Annual Leave, Medical Leave, Hospitality Leave.
Shift Pattern:
2 shift
Monday to Saturday
8 am to 8 pm (inlcude OT)
8pm to 8 am (inclued OT)
Offday / Restday : Alternate
Night Allowance
Must Have:
Education - Dip / Certificate in Mechanical (Mold & Die)
Possess a reasonable working knowledge in the related practices in the industry
Able to use computer and familiar with MS Office
Good communication & interpersonal skills
Applicants must be willing to work in Ampang KL.
Job Scope:
Define the process window
Good in problem solving and work on the Root Cause Analysis/Finding
Work closely with development team
Ensure smooth transition from Development to new product qualification phase.
Work closely with manufacturing process and equipment team
Report any non-conformance/customer complaint issue and develop/follow up the improvement actions.
Interview will be arrange on this Friday and onwards. Please do not hesitate to whatsapp me : 012-9970466 (En Ali) or click at this link: https://wa.link/1o1jqn
Job Types: Full-time, Permanent
Pay: RM2,200.00 - RM3,800.00 per month
Work Location: In person
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Job Detail
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Job IdJD1305411
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationAmpang, M10, MY, Malaysia
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EducationNot mentioned